In situ transmission electron microscopy of transistor operation and failure

作者: Baoming Wang , Zahabul Islam , Aman Haque , Kelson Chabak , Michael Snure

DOI: 10.1088/1361-6528/AAC591

关键词:

摘要: Microscopy is typically used as a post-mortem analytical tool in performance and reliability studies on nanoscale materials devices. In this study, we demonstrate real time microscopy of the operation failure AlGaN/GaN high electron mobility transistors inside transmission microscope. Loading until was performed transparent to visualize mechanisms caused by self-heating. At lower drain voltages, thermo-mechanical stresses induce irreversible microstructural deformation, mostly along interface, initiate damage process. higher biasing, self-heating deteriorates gate catastrophic takes place through metal/semiconductor inter-diffusion and/or buffer layer breakdown. This study indicates that current trend recreating events, from nucleation failure, can be replaced situ for quick accurate account mechanisms.

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