Metal deposition using seed layers
作者： Bed Poudel , Zhifeng Ren , Hsien-Ping Feng , Shuo Chen , Gang Chen
DOI:
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摘要: Methods of forming a conductive metal layers on substrates are disclosed which employ seed layer to enhance bonding, especially smooth, low-roughness or hydrophobic substrates. In one aspect the invention, can be formed by applying nanoparticles onto surface substrate; and metallization is achieved electroplating an electrically conducting layer, whereby serve as nucleation sites for deposition. another approach, self-assembling linker material, such sulfur-containing silane material.
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