Surface pretreatment and drop spreading control on multi component surfaces

作者: Boaz Nitzan

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摘要: Methods, systems and produced printed substrates are provided, which include composed of one or more materials treated by an intermediate layer for normalizing surface energies a digitally formulation adapted to the normalized energies. Surface energy normalization may be carried out physical processes selective chemical processes. In example, self-assembled monolayer is applied circuit board control ink jet dots reducing copper improve adhesion. The binds via α group selectively covalently on hydrophobic ω solder mask that board. participates in solidification process ink.

参考文章(10)
Natalia Briones, Vi-En Choong, W. Travis Johnson, Method for adhesion of polymers to metal-coated substrates ,(2001)
Bed Poudel, Zhifeng Ren, Hsien-Ping Feng, Shuo Chen, Gang Chen, Yu Bo, Metal deposition using seed layers ,(2011)
Hiroshi Kiguchi, Tatsuya Shimoda, Satoshi Nebashi, Hitoshi Fukushima, Pattern formation method and substrate manufacturing apparatus ,(2003)
Sivapackia Ganapathiappan, Gun Young Jung, Zhiyong Li, Richard Stanley Williams, Increasing adhesion in an imprinting procedure ,(2004)
Gerhard Nauer, Zhao Ping, Fritz Haring, Guenther Leising, Johannes Stahr, Method for Coating Blanks for the Production of Printed Circuit Boards (Pcb) ,(2004)
Mark H. Kowalski, Anthony R. James, Scott James Haubrich, Controlling ink migration during the formation of printable electronic features ,(2006)
Gary A. Korba, Peter T. Elliott, John C. Clark, Naiyong Jing, Caroline M. Ylitalo, Method for modifying the surface of a substrate ,(2003)