Heat sink fin assembly for cooling an LSI package
作者： Keiji Miki , Masayasu Kojima , Chihiro Hayashi , Tetsuo Abiko
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摘要: A heat sink fin assembly of the corrugated type for cooling an LSI package comprises a flat base plate and dissipating member made thin metal sheet having convex concave portions which are comprised repeated series side wall portions, top bottom portions. The integrated with each other by bonding.
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