LSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mounted

摘要: Disclosed is an LSI package cooling heat sink having a diffusion plate and thin wire fins joined to the plate. The mounted on cooled by flowing of fluid through fins. are made net formed longitudinal wires intersecting with horizontal wires. continuous rectangular shapes or swirl shape constituted so that number vertical larger than parallel thereto brazing, joint, pressure welding like. Since composed wires, irregular portions adjacent at dislocated position striking against produces many turbulent flows high transfer performance can be obtained. Further, since used, size reduced noise also lowered. it possible produce in short time which excellent mass-production.