作者: C.S. Fuller , K.B. Wolfstirn
DOI: 10.1016/0038-1098(64)90046-8
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摘要: It has been found that after diffusion of Cu64 into GaAs at ∼700°C or above, an almost equal conc. can be introduced 500°C provided the initial is below for saturation higher temperature. The Cu reacts with defects (presumably As vacancies) remaining from temperature diffusion. 1:1 correspondence between high and low temperatures taken as evidence initially divacancies.