Process for flip-chip bonding a semiconductor die having gold bump electrodes

摘要: A method for flip-chip bonding an integrated circuit die to a substrate. The includes the steps of providing with at least one gold bump, forming barrier layer on bronzing agent layer, and substrate conductive area, which is also covered gold. then aligned compression force applied so as establish contact between area. While maintaining position bump structure alloyed such that area form intermetallic compound, thereby bond functions prevent from diffusing bump.