Wafer substrate bonding structure and light emitting device comprising the same
作者： Bum Chul Cho
DOI:
关键词:
摘要: A wafer substrate bonding structure may be provided that includes: a first (220); and conductive thin film (240) which is disposed on the includes resin corpuscles included in resin. semiconducting light emitting layer (500,511,512,513) bonded thereon.
lens.org 参考文章(20)
Siegfried Herrmann, Berthold Hahn, Stefan Gruber, Joerg Erich Sorg, Light-emitting diode arrangement and method for producing the same ,(2007)
Hiroaki Matsumura, Semiconductor light emitting device and method for fabricating the same ,(2008)
Masahiko Tsuchiya, Naochika Horio, Hitoshi Tamura, Semiconductor light emitting device capable of suppressing silver migration of reflection film made of silver ,(2004)
Jong Lam Lee, GaN compound semiconductor light emitting element and method of manufacturing the same ,(2005)
Dae Won Kim, Eu Jin Hwang, Jong Lam Lee, Yeo Jin Yoon, Jae Ho Lee, Light-emitting device and method of manufacturing the same ,(2009)
Sang Ho Yoon, Jong Gun Woo, In Tae Yeo, Doo Go Baik, Su Yeol Lee, Tae Sung Jang, Dong Woo Kim, Seok Beom Choi, Bang Won Oh, Vertical gallium nitride-based light emitting diode and method of manufacturing the same ,(2007)
Yasushi Goto, Tomohisa Ohta, Isao Tsukagoshi, Anisotropically electroconductive resin film ,(1995)
Tae Sub Bae, Jung Il Park, Jin Gyu Park, Sang Woon Lee, Jae Ho Lee, Jung Bae Jun, Conductive particles comprising complex metal layer with density gradient, method for preparing the particles, and anisotropic conductive adhesive composition comprising the particles ,(2007)
Seiji Tawaraya, Mitsuru Iida, 誠治 俵屋, 満 飯田, Base plate for electroluminescent element ,(2005)
Hisami Bessho, Masatsugu Shimomura, Akio Sato, Masaru Tanaka, Hiroshi Yabu, Hideyuki Sato, Anisotropic conductive film and manufacturing method thereof ,(2005)