Positive photosensitive resin composition, cured layer , protecting layer, insulating layer and semiconductor device and display therewith
作者： Hiroaki Makabe
DOI:
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摘要: A positive-type photosensitive resin composition comprises (A) an alkali-soluble having at least a polybenzoxazole precursor structure, (B) sensitizer, and (C) cyclic compound alcoholic hydroxyl group. protecting layer insulating include cured which is product of the composition. semiconductor device display layer. According to present invention, highly reliable can be obtained even when low temperature.
lens.org 参考文章(8)
Masataka Nunomura, Yoshiko Tsumaru, Masayuki Ooe, Takumi Ueno, Hajime Nakano, Photosensitive polymer composition, method of forming relief patterns, and electronic equipment ,(2010)
Yoji Fujita, Mitsuhito Suwa, Tomoyuki Yuba, Photosensitive resin precursor composition ,(2004)
Hiroshi Hitachi Chemical Co. Ltd. Matsutani, Takashi Hitachi Chemical Co. Ltd. Hattori, Masayuki Hitachi Chemical Co. Ltd. Ooe, Hajime Hitachi Chem.DuPont Microsyst. Ltd Nakano, Yasuharu Hitachi Chemical Co. Ltd. Murakami, Positive photosensitive resin composition, method for forming pattern, and electronic component ,(2005)
Hiroshi Komatsu, Photosensitive resin composition, process for forming relief pattern, and electronic component ,(2003)
Robert P. Meagley, Shusaku Okaaki, Michael D. Goodner, Takashi Hirano, Positive photosensitive resin composition, process for its preparation, and semiconductor devices ,(2001)
Masao Tomikawa, Mitsufumi Suwa, 諏訪 充史, 富川 真佐夫, Positive photosensitive resin composition, method for manufacturing semiconductor device and semiconductor device ,(2002)
Toshio Banba, Takashi Hirano, 敏夫 番場, 孝 平野, Positive photosensitive resin composition, semiconductor device and display element, and method for manufacturing semiconductor device and display element ,(2004)
Taniguchi Ryuichiro, Tomikawa Masao, Mitsui Hiroko, THERMOSETTING RESIN COMPOSITION ,(2007)