Semiconductor device manufacturing method and projection exposure apparatus using the same
作者： Miyoko Noguchi
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摘要: A semiconductor device manufacturing method is disclosed, which includes the steps of illuminating obliquely an original having a grating-like pattern, with light beam main wavelength λ, and projecting portion diffraction produced by pattern onto pupil plane projection optical system numerical aperture NA, so as to project predetermined related photosensitive substrate, wherein has partially isolated auxiliary such no adjoining within range D≦(λ/NA) where D distance from one side thereof measured on plane, linewidth L satisfies relation L≦0.2(λ/NA) it extends parallel at least provided S in direction substantially perpendicular side, rage 0≦S≦0.1(λ/NA).
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