A novel z-directed embedded component for the reduction of voltage ripple on the power distribution network for PCBs

摘要: A new capacitor package and PCB embedding technique is introduced to significantly reduce the system power distribution network impedance at pads of surface mounted integrated circuits. The multi-layer ceramic (MLCC) that a right cylindrical shape with via channels in outer wall along axis part. called Z-Directed component (ZDC) then pressed into hole PCB. connections are made by copper plating process similar construction. This configuration dramatically improves PDN performance PCBs fewer components than conventional solution SMD decoupling capacitors.