Integrated circuit semiconductor device formed on a wafer

摘要: An integrated circuit semiconductor device of very large scale (VLSI) formed in a wafer, namely wafer IC, is disclosed having blocks (2) arranged matrix fashion and isolated from each other by an intermediate area locating between the blocks. The are connected to interconnecting circuitformed on insulative film (10) order complete lC. connection performed bonding corresponding pads (4, 9, 6B, 11B) disposed (2), repair chip (8) (6) conventional process. With this structure lC, individual can be easily accessed advance computer aided testing apparatus defective replaced chips prepared advance, without needing any additional work circuits. predetermined layout pattern allow interchangeability, replacement block being possible regardless its location. flexibility allows protruding top surface accommodated to.