Method for packaging a semiconductor chip containing sensors and resulting package
作者： Antonio Chez M. et Mme Lemoine Do Bento Vieira
DOI:
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摘要: The invention concerns a method for producing package (30) semiconductor chip comprising (20) one or several bond pads on the top surface providing terminals sensors (22) in upper and carrier (32) an opening (34) external terminals. is fixed to lower such that sensor(s) are arranged beneath first interface zone (40) formed, wherein extends beyond each pad coupled portion of exposed at example with weld points (42). A sealing ring (44, 46) encapsulates coating material (48) (20).
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