In Situ Stress Measurements during Aluminum Deposition from AlCl3‐EtMeImCl Ionic Liquid
作者： G. R. Stafford , O. E. Kongstein , G. M. Haarberg
DOI: 10.1149/1.2168048
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摘要: In situ stress measurements were made during aluminum electrodeposition from Lewis acidic chloride-1-ethyl-3-methylimidazolium chloride (AlCl 3 -EtMeImCl) using the wafer curvature method. The underpotential deposition of Al on (111)-textured Cu shows a response that is consistent with two-step process where first step involves desorption AlCl - 4 surface. This results in tensile surface which adsorbate-induced models appear literature. eliminated when full incommensurate monolayer formed. On Au, can be attributed to both lattice misfit and Al-Au alloying. bulk Au appears governed by Stranski-Krastanov three-dimensional growth. Initially compressive observed we attribute capillarity effects. followed rapid increase nuclei coalescence grain boundary formation. this region nucleation growth, total superposition mechanisms each dependent potential.
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