Microstructure evolution and bonding mechanism of Ti2SnC-Ti6Al4V joint by using Cu pure foil interlayer
作者： W Yu , H Zhao , Z Huang , X Chen , Y Aman
DOI: 10.1016/J.MATCHAR.2017.01.035
关键词:
摘要: … atoms from Ti 2 SnC lattice towards to TC4 in Cu foil was confirmed. … TC4/Cu/TC4 obtained after 60 min, (d) the magnification image implies the reaction zone between Cu foil and TC4. …
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