Diffusion Bonding of Intermetallic Compound TiAl.

摘要: This study was carried out in order to develop a satisfactory technique for joining TiAl intermetallic compounds. Ti-38mass%Al binary cast alloys were bonded vacuum of 26 mPa using the solid state diffusion bonding method by varying conditions, viz. temperature varied from 1273 o 1 473 K, pressure 10 30 MPa and time 0.96 3.84 ks.From metallurgical point view, diagrams with conditions produced obtain sound joint without microvoids oxides such as TiO2 or Al2TiO5 at interface. According these diagrams, joints mechanical testing 1473 K ks 15 MPa.The tensile strength room about 225 factured base metal zone. However, temperatures 073 273 fractured interface 40 lower than that metal, because minimal migration occurred.The recrystallized zone promote sequently improved property previous post-bonding heat-treatments. The grain size around 130 μm 210 departed even K.