Recrystallization Behavior at Diffusion Bonding Interface of High Nb Containing TiAl Alloy
作者： Bin Tang , Xian Sheng Qi , Hong Chao Kou , Jin Shan Li , Srdjan Milenkovic
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摘要: A series of diffusion bonding tests are conducted on a high Nb containing TiAl alloy with full lamellar (FL) microstructure and the effect interfacial recrystallization behavior shear strength is discussed. Microstructural observations reveal that above 1 100 °C 30 MPa results in at interface flanked by FL microstructure, thus promoting migration leading to sound joint. Based present results, nucleation mechanism studied. Shear testing show bonded zone improves quality joints changing failure mode. The attains 400 MPa when 1 150 °C/30 MPa/45 min 1 100 °C/40 MPa/45 min.
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