Test carrier for packaging semiconductor components having contact balls and calibration carrier for calibrating semiconductor test systems

摘要: A test carrier for testing bumped semiconductor components such as dice, chip scale packages, BGA devices, and wafers includes a base retaining one or more contact members making temporary electrical connections with balls on the (e.g., solder balls). The also terminal contacts formed hard metal balls, coated non-oxidizing layer, glass, ceramic plastic conductive material. protect from deformation during handling. are configured multiple uses in production environment without deformation. calibration calibrating systems on-board evaluation circuitry evaluating characteristics of system, resistances between connectors socket carrier. cleaning wettable material to attract contaminants sockets.