Method and apparatus for cooling integrated circuits using a thermoelectric module
作者： Robert D. Padilla , Rakesh Bhatia , G. Hermerding Ii James
DOI:
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摘要: An integrated circuit cooling device in which a thermoelectric module (TEM) is built into printed board (PCB) so that the TEM converts heat generated by an on PCB DC power then supplied to DC--DC regulator drive fan. In one embodiment, fan incorporated within sink disposed side of built-in between and being cooled. alternate located remotely from sink.
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