ETCHING TO SEMICONDUCTOR WAFER AND DEVICE

摘要: PROBLEM TO BE SOLVED: To efficiently etch a semiconductor wafer without using large quantity of an etching liquid. SOLUTION: A pipe 4 is arranged on the bottom in interior tank 1 and air jetted liquid 2 through nozzles formed to perform bubbling. One part subjected temperature rise by bubbling introduced coolers 5. After cooled heat exchange 5, returned into 1. When 4, does not stagnate surfaces wafers 3 bubbling, accelerated risen. As needed.