Cavity and bump interconnection structure for electronic packages
作者： Mohi Sobhani
DOI:
关键词:
摘要: Electronic interconnection of two printed wiring structures. Two boards (11, 16) or a flexprint circuit (20) and board (11) are interconnected by creating plated hole pattern (12) on surface the (11), wherein holes (13) have concave cross section. The mated with corresponding bumps (17) dimples disposed second (16) (20). formed in first predetermined depth below (18) typically to between 0.007 inches 0.020 surface. plurality electroless plating electroplating (13). present structure (10) provides for reliable self aligning (11).
lens.org 参考文章(17)
James J Steranko, Method of forming an interconnecting multilayer circuitry ,(1967)
Jason R. Arbeiter, Patricia S. Brown, Arthur K. Wilson, Electrical interconnect system for a flexible circuit ,(1994)
Marcos Karnezos, An interconnect structure for PC boards and integrated circuits ,(1988)
Richard F. Frankeny, Karl Hermann, Multi-level circuit structure utilizing conductive cores having conductive protrusions and cavities therein ,(1989)
Frank J. Juskey, Barry M. Miles, Anthony B. Suppelsa, Pad grid array for receiving a solder bumped chip carrier ,(1989)
William R. Crumly, Christopher M. Schreiber, Haim Feigenbaum, Electrical connections with shaped contacts ,(1993)
Kenneth C. Thompson, Robert S. Reylek, Miniature multiple conductor electrical connector ,(1991)
William R. Crumly, Christopher M. Schreiber, Stackable high density interconnection mechanism (SHIM) ,(1992)
Christopher M. Schreiber, Haim Feigenbaum, Method for electrodepositing corrosion barrier on isolated circuitry ,(1992)
Mohi Sobhani, Electrical interconnection method and apparatus utilizing raised connecting means ,(1992)