Method for electrodepositing corrosion barrier on isolated circuitry

摘要: A corrosion resistant barrier is provided for isolated circuity. An circuit (10, 12) with raised interconnection features (16, 18) having a gold coating (34) formed on reusable stainless steel mandrel (22) which indentations to define features. seed layer (32) of copper electroplated the in pattern be formed. The then followed by layers (34), nickel (36) and (38) until total desired conductor thickness achieved. dielectric substrate (44, 46) laminated multilayer conductive traces circuit. After removal from mandrel, predrilled coverlay (50) holes receiving (52). finished part etched remove