Application of cluster-plus-glue-atom model to barrierless Cu-Ni-Ti and Cu-Ni-Ta films
作者： Xiaona Li , Jianxin Ding , Miao Wang , Jinn P. Chu , Chuang Dong
DOI: 10.1116/1.4897616
关键词:
摘要: … In this paper, the cluster-plus-glue-atom model was used for the composition design of a barrierless Cu–Ni–M (M = Ti or Ta) seed layer, and Cu–Ni–M (M = Ti or Ta) ternary alloy films …
scitation.org
harvard.edu
aip.org 
sci-hub.se 参考文章(25)
K. Barmak, A. Gungor, C. Cabral, J. M. E. Harper, Annealing behavior of Cu and dilute Cu-alloy films: Precipitation, grain growth, and resistivity Journal of Applied Physics. ,vol. 94, pp. 1605- 1616 ,(2003) , 10.1063/1.1589593
Chin‐An Chang, Formation of copper silicides from Cu(100)/Si(100) and Cu(111)/Si(111) structures Journal of Applied Physics. ,vol. 67, pp. 566- 569 ,(1990) , 10.1063/1.345194
Y. Meng, Z.X. Song, D. Qian, W.J. Dai, J.F. Wang, F. Ma, Y.H. Li, K.W. Xu, Thermal stability of RuZr alloy thin films as the diffusion barrier in Cu metallization Journal of Alloys and Compounds. ,vol. 588, pp. 461- 464 ,(2014) , 10.1016/J.JALLCOM.2013.11.085
S. Tsukimoto, T. Morita, M. Moriyama, Kazuhiro Ito, Masanori Murakami, Formation of Ti diffusion barrier layers in thin Cu(Ti) alloy films Journal of Electronic Materials. ,vol. 34, pp. 592- 599 ,(2005) , 10.1007/S11664-005-0070-0
Yu-Lin Kuo, Jui-Jen Huang, Shun-Tang Lin, Chiapyng Lee, Wen-Horng Lee, Diffusion barrier properties of sputtered TaNx between Cu and Si using TaN as the target Materials Chemistry and Physics. ,vol. 80, pp. 690- 695 ,(2003) , 10.1016/S0254-0584(03)00106-8
H. Ono, T. Nakano, T. Ohta, Diffusion barrier effects of transition metals for Cu/M/Si multilayers (M=Cr, Ti, Nb, Mo, Ta, W) Applied Physics Letters. ,vol. 64, pp. 1511- 1513 ,(1994) , 10.1063/1.111875
Ying Wang, Fei Cao, Mi-lin Zhang, Yun-tao Liu, Effects of thermal annealing on Zr–N doped magnetron sputtered copper Thin Solid Films. ,vol. 519, pp. 3407- 3410 ,(2011) , 10.1016/J.TSF.2010.12.095
Nils Laegreid, G. K. Wehner, Sputtering Yields of Metals for Ar+ and Ne+ Ions with Energies from 50 to 600 ev Journal of Applied Physics. ,vol. 32, pp. 365- 369 ,(1961) , 10.1063/1.1736012
X.N. Li, M. Wang, L.R. Zhao, C.M. Bao, J.P. Chu, C. Dong, Thermal stability of barrierless Cu–Ni–Sn films Applied Surface Science. ,vol. 297, pp. 89- 94 ,(2014) , 10.1016/J.APSUSC.2014.01.084
X. N. Li, L.J. Liu, X.Y. Zhang, J.P. Chu, Q. Wang, C. Dong, Barrierless Cu-Ni-Mo Interconnect Films with High Thermal Stability Against Silicide Formation Journal of Electronic Materials. ,vol. 41, pp. 3447- 3452 ,(2012) , 10.1007/S11664-012-2260-X