Enhanced adhesion of copper to dielectrics via titanium and chromium additions and sacrificial reactions
作者： S.W. Russell , S.A. Rafalski , R.L. Spreitzer , J. Li , M. Moinpour
DOI: 10.1016/0040-6090(94)05812-1
关键词:
摘要: … In the Cu(Ti) and Cu(Cr) alloy systems the force increases with temperature with less systematic difference among the three substrates. These results correlate well with tape testing. Ti …
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