Preparation of copper coated tungsten powders by intermittent electrodeposition

摘要: Abstract This paper reported the findings that copper-coated tungsten (W@Cu) powders were successfully fabricated by intermittent electrodeposition. The influence of process parameters such as stirring frequency, load powders, current density and deposition time investigated. As-coated characterized using scanning electron microscopy, energy dispersive spectroscopy, X-ray diffraction. optimum technical established for preparing W@Cu composite powders. with uniform, dense, consistent Cu coating obtained under conditions powder content 8–12 g·dm− 3 in electrolyte, 12–16 A·dm− 2, frequency 20–30 h− 1. uncoated W particles not observed after 22.5 min deposition. homogeneously coated copper > 30.0 wt.% content. bath could be effectively prevented from agglomeration controlling proper density. a thickness ~ 2.5 μm ~ 54 wt.% produced without adhering to cathode plate. nucleation mechanisms electrodeposition examined fitting experimental chronoamperogram data into Scharifker–Hills models. results indicated nucleates according instantaneous high High is necessary produce over-potential increase fraction nucleation, which was beneficial preparation uniform films. laid foundation fabricating improved properties via