Stress/strain characterization in electronic packaging by micro-Raman spectroscopy: A review
作者： Xuejun Fan , Wei Qiu , Lulu Ma , Lulu Ma
DOI: 10.1016/J.MICROREL.2021.114045
关键词:
摘要: Abstract In this review, a review of the applications micro-Raman spectroscopy (μRS) to characterize residual strain and/or stress in electronic packaging is presented. Micro-Raman considered as an effective tool for evaluation semiconductor devices at microscale level due its nondestructive, noncontact feature with high spatial resolution. comparison μRS other measurement techniques, such DIC, micro moire and XRD has been illustrated. The range problems that can be characterized by discussed. basics stress/strain described recent progress including shear component discussed detail. Two case studies use are presented, application through silicon via (TSV) flip chip assembly. Finally, several challenges future development
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