Interposer for inspection for semiconductor chip
作者： Shin Woo Yeol , Seo Jae Hwan
DOI:
关键词:
摘要: An interposer for inspecting reliability of a semiconductor chip is disclosed. The inspection includes: at least one active pad disposed in an region first surface, and including: pads through which data control signal testing target are received (input) sent (output) during mode; receiving power-supply voltage needed to operate the passive mode, bump over second surface facing be coupled chip.
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