Semiconductor wafer with electrically connected contact and test areas
作者： Bernd Goller , Bernd Kothe , Werner Ertle , Michael Horn
DOI:
关键词:
摘要: The invention relates to an arrangement of contact areas and test on patterned semiconductor chips. the are electrically connected one another via a conduction web. Whereas arranged in first region, which has no components integrated circuit, lie second region top side chip, circuit.
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