Semiconductor wafer and fabrication method of a semiconductor chip
作者： Jae Woon Kim , Jong Hoon Park
DOI:
关键词:
摘要: The present invention relates to a semiconductor device, and more particularly structure of wafer fabrication method chips. According the invention, containing plurality chip portions has scribe lanes formed between portions. A bonding pads are on wafer, probing lanes. electrically connected internal circuits and/or corresponding ones pads.
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