Semiconductor package and fabrication method of the same

作者: Kye Chan Park

DOI:

关键词: Electrical engineeringSemiconductor packageOptoelectronicsReliability (semiconductor)Substrate (printing)ChipFabricationLead frameFlip chipMaterials scienceElectrode

摘要: Disclosed is a semiconductor package capable of realizing small and compact size improving the reliability fabrication method same. The disclosed comprises: main chip having plurality pads operating as lead frame or substrate; metal patterns electrically connected to each corresponding pad electrodes formed on both ends; one more sub adhered by adhering bumps electrode; dam in shape surrounding inner except for outer outmost region chip; filling materials filled up dam; solder balls electrodes.

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