作者: Kye Chan Park
DOI:
关键词: Electrical engineering 、 Semiconductor package 、 Optoelectronics 、 Reliability (semiconductor) 、 Substrate (printing) 、 Chip 、 Fabrication 、 Lead frame 、 Flip chip 、 Materials science 、 Electrode
摘要: Disclosed is a semiconductor package capable of realizing small and compact size improving the reliability fabrication method same. The disclosed comprises: main chip having plurality pads operating as lead frame or substrate; metal patterns electrically connected to each corresponding pad electrodes formed on both ends; one more sub adhered by adhering bumps electrode; dam in shape surrounding inner except for outer outmost region chip; filling materials filled up dam; solder balls electrodes.