Fabrication process of semiconductor package and semiconductor package
作者： Naoki Fukutomi , Yoshiaki Tsubomatsu , Hirohito Ohhata , Toshio Yamazaki , Fumio Inoue
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摘要: A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. nickel layer plated on an electroplated copper foil to form a wiring pattern. An LSI chip mounted foil, and terminals pattern are connected by wire bonding, followed sealing with semiconductor-sealing epoxy resin. Only dissolved away alkali etchant expose nickel. With stripper having low copper-dissolving power, removed solder resist coated, formed in such way that connecting terminal portions exposed. Solder balls placed at exposed then fused. The external printed board via balls.
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