Electronic device and chip package
作者： Mou-Shiung Lin , Bryan Peng
DOI:
关键词: Optoelectronics 、 Flip chip 、 Chip 、 Substrate (printing) 、 Materials science 、 Soldering
摘要: The package includes a substrate, first chip, second multiple bumps and bumps. substrate has region region. is substantially coplanar with the connect chip chip. of wherein over substrate. have height greater than that plus does not an opening accommodating may be gold or solder
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