Vertically integrated flip chip semiconductor package

摘要: Provided is a vertically integrated (“chip-over-chip”) semiconductor package and packaging method. The invention provides higher density performance, including increased functionality, decreased signal propagation delays, improved circuit switching speed, lower thermal resistance dissipation measurements, relative to previous designs. According the invention, may be composed of flip chip (or chips) overlying one or more other chips, all electrically bonded bond pads on cavity-less substrate. upper flips chips assembled in variety different configurations thermally connected each other. In preferred embodiment, particularly chip(s), are thinned so that overall height within conventional ranges for traditional single packages. Packages accordance with have access speeds between reduced total footprint.