Integrated circuit package system with heatspreader
作者： Philip Lyndon Cablao , Emmanuel Espiritu , Dario S. Filoteo , Allan Ilagan , Leo A. Merilo
DOI:
关键词:
摘要: An integrated circuit package system includes providing a substrate having an circuit, attaching heatspreader force control protrusion on the substrate, and forming encapsulant over circuit.
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