Heat sink with collapse structure and semiconductor package with heat sink
作者： Chien-Ping Huang , Jui-Yu Chuang , Chi-Chuan Wu , Lien-Chi Chan
DOI:
关键词:
摘要: A heat sink with a collapse structure and semiconductor device the are proposed, in which is ladder-like shape due to height difference formed between an extending portion body of sink, has at least one surface exposed outside package. The produces deformation response stress from engagement molds molding process, so as prevent chip being damaged by stress. directly attached allows generated pass through then can be dissipated package, improve dissipating efficiency.
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