Thermally enhanced flip chip package

作者： Eric Arthur Johnson

DOI:

关键词:

摘要: A thermally conductive planar member is in communication with a flip chip encapsulated within dielectric material that surrounds portions of the member, chip, and predefined portion substrate member. The present invention provides package having pick-and-place capability without thermal resistance disadvantage capped packages.

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参考文章(5)

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