A multi-scale damage mechanics framework for nanoelectronics interconnects and solder joints

A. Dasgupta, J.M. Hu, Failure mechanism models for brittle fracture IEEE Transactions on Reliability. ,vol. 41, pp. 489- 495 ,(1992) , 10.1109/24.159794

Shidong Li, Michael Sellers, Cemal Basaran, Andrew Schultz, David Kofke, Lattice Strain Due to an Atomic Vacancy International Journal of Molecular Sciences. ,vol. 10, pp. 2798- 2808 ,(2009) , 10.3390/IJMS10062798

Hua Ye, Cemal Basaran, Douglas C. Hopkins, Experimental Damage Mechanics of Micro/Power Electronics Solder Joints under Electric Current Stresses International Journal of Damage Mechanics. ,vol. 15, pp. 41- 67 ,(2006) , 10.1177/1056789506054311

Hua Ye, Cemal Basaran, Douglas C. Hopkins, Mechanical degradation of microelectronics solder joints under current stressing International Journal of Solids and Structures. ,vol. 40, pp. 7269- 7284 ,(2003) , 10.1016/J.IJSOLSTR.2003.08.019

C. Basaran, C.-Y. Yan, A Thermodynamic Framework for Damage Mechanics of Solder Joints Journal of Electronic Packaging. ,vol. 120, pp. 379- 384 ,(1998) , 10.1115/1.2792650

Shidong Li, M.F. Abdulhamid, C. Basaran, Damage Mechanics of Low Temperature Electromigration and Thermomigration IEEE Transactions on Advanced Packaging. ,vol. 32, pp. 478- 485 ,(2009) , 10.1109/TADVP.2008.2005840

Zdeněk P. Bažant, Why Continuum Damage is Nonlocal: Micromechanics Arguments Journal of Engineering Mechanics-asce. ,vol. 117, pp. 1070- 1087 ,(1991) , 10.1061/(ASCE)0733-9399(1991)117:5(1070)

Dimitri D Vvedensky, Multiscale modelling of nanostructures Journal of Physics: Condensed Matter. ,vol. 16, ,(2004) , 10.1088/0953-8984/16/50/R01

Physical limits of silicon transistors and circuits Reports on Progress in Physics. ,vol. 68, pp. 2701- 2746 ,(2005) , 10.1088/0034-4885/68/12/R01

Yi-Shao Lai, Chin-Li Kao, Characteristics of current crowding in flip-chip solder bumps Microelectronics Reliability. ,vol. 46, pp. 915- 922 ,(2006) , 10.1016/J.MICROREL.2005.02.007