Characteristics of current crowding in flip-chip solder bumps
作者： Yi-Shao Lai , Chin-Li Kao
DOI: 10.1016/J.MICROREL.2005.02.007
关键词:
摘要: For a flip-chip package assembly, current crowding occurs in the vicinity of locations where traces connect solder bumps. This feature contributes significantly to electromigration failure In this study finite element analysis is performed investigate characteristics bump subjected constant applied current. It found that under such condition, induced solely by structural geometry system. independent magnitude A volumetric averaging technique also cope with singularity.
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sci-hub.se 参考文章(11)
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