Electromigration-induced cracks in Cu/Sn3.5Ag/Cu solder reaction couple at room temperature
作者： He Hongwen , Xu Guangchen , Guo Fu
DOI: 10.1088/1674-4926/30/3/033006
关键词:
摘要: Electromigration (EM) behavior of Cu/Sn3.5Ag/Cu solder reaction couple was investigated with a high current density 5 × 103 A/cm2 at room temperature. One dimensional structure, copper wire/solder ball/copper wire SRC designed and fabricated to dissipate the Joule heating induced by flow. In addition, thermomigration effect excluded due symmetrical structure SRC. The experimental results indicated that micro-cracks initially appeared near cathode interface between matrix substrate after 474 h stressing. With stressing time increased, cracks propagated extended along interface. It should be noted continuous Cu6Sn5 intermetallic compounds (IMCs) layer both anode remained their sizes. Interestingly, tiny root some long column-type thermal stress.
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