Design of solder joints for fundamental studies on the effects of electromigration

摘要: The continuous miniaturization of high performance electronic devices has reached a level at which current densities are large enough to make electromigration (EM) significant issue affecting the electrical and mechanical reliability solder joints. A new design joints that controls extent regions experiencing relatively uniform density, as well with density gradient was developed. Current distribution this newly designed joint calculated using finite element analysis (FEA), used guide characterization EM real As part effort in evaluating suitability configuration for fundamental issues EM, eutectic PbSn were fabricated design. effects due applied current, distribution, thickness present investigated. Findings based on can facilitate studies affect