In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing
作者： Y.H. Lin , Y.C. Hu , C.M. Tsai , C.R. Kao , K.N. Tu
DOI: 10.1016/J.ACTAMAT.2005.01.014
关键词: Materials science 、 Eutectic system 、 Current density 、 Composite material 、 Failure mechanism 、 Metallurgy 、 Void (astronomy) 、 Current crowding 、 Electromigration 、 Dominant factor 、 Soldering
摘要: Abstract The electromigration of PbSn eutectic flip-chip solder joints was studied at 30 °C with a nominal current density 4 × 10 4 A/cm 2 . void formation-and-propagation failure mechanism observed in situ. In the joint electrons flowing from chip side to substrate side, nucleated near crowding region after an incubation period that lasted between 30 and 50 min. This then propagated across under bump metallurgy very quickly, eventually resulted about another 40 min. concurrent melting joint. survived stressing. directly reflects is dominant factor responsible for joints. study shows time nucleation good indicator real lifetime current-stressing.
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