Multilayer printed wiring boards with holes requiring copper wrap plate
作者： Rajwant Singh Sidhu
DOI:
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摘要: Printed circuit boards have layers with one or more via filled holes copper wraps and methods of manufacturing the same. An embodiment present invention provides a method to enhance consistency wraparound plating through-hole vias printed (requiring) filling provide extra reliability enables designers and/or manufacturers design manufacture relatively fine features tight geometries.
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