Biocompatible electroplated interconnection bonding method and electronics package suitable for implantation

摘要: The invention is directed to a method of bonding hermetically sealed electronics package an electrode or flexible circuit and the resulting that suitable for implantation in living tissue, such as retinal cortical array enable restoration sight certain non-sighted individuals. directly bonded flex by electroplating biocompatible material, platinum gold, effectively forming plated rivet-shaped connection, which bonds package. electronic device long-term tissue. present comprising substrate containing at least one contact, assembly pad, electroplated between said contact pad together. assembly, steps of: aligning whereby there common alignment on pads contacts pads, thereby substrate.