Semiconductor package having flex circuit with external contacts
作者： Warren M. Farnworth , Mike Brooks , Alan G. Wood
DOI:
关键词:
摘要: A chip scale semiconductor package and a method for fabricating the are provided. The includes die flex circuit bonded to face of die. polymer substrate with dense array external contacts, pattern conductors in electrical communication contacts. also interconnects configured provide separate paths between contacts (e.g., bond pads), on circuit. Several different embodiments provided including: bumps conductive adhesive layer; conductors, or applied semi-cured state then fully cured; solder one another using bonding tool; rivet-like connections formed metal wire ball apparatus; single point bonds
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