An effective SPC approach to monitoring semiconductor manufacturing processes with multiple variation sources

摘要: In this research, we develop an integrated sampling and statistical process control (SPC) strategy for semiconductor processes with multiple variation sources. We first construct a model to characterize the complex nature of processes. Three types variations: among-site, among-zone among-batch variations, are considered in model. Based on rational sub-grouping techniques, multivariate. T/sup 2/ charts then proposed monitor variations. It is shown that more effective than conventional charting techniques detecting various excursions.