A monitoring method of semiconductor manufacturing processes using Internet of Things–based big data analysis:

作者: Seok-Woo Jang , Gye-Young Kim

DOI: 10.1177/1550147717721810

关键词:

摘要: This article proposes an intelligent monitoring system for semiconductor manufacturing equipment, which determines spec-in or spec-out for a wafer in process, using Internet of …

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