Adhesion of copper to poly(tetrafluoroethylene-co-hexafluoropropylene) (FEP) surfaces modified by vacuum UV photo-oxidation downstream from Ar microwave plasma

作者: W. Dasilva , A. Entenberg , B. Kahn , T. Debies , G.A. Takacs

DOI: 10.1163/1568561042323202

关键词:

摘要: Poly(tetrafluoroethylene-co-hexafluoropropylene) (FEP) surfaces were exposed to vacuum UV (VUV) photo-oxidation downstream from Ar microwave plasma. The modified showed the following: (1) an improvement in wettability as observed by water contact angle measurements; (2) surface roughening; (3) defluorination of surface; and (4) incorporation oxygen CF—O—CF2, CF2—O—CF2 CF—O—CF3 moieties. With long treatment times, a cohesive failure copper sputter-coated onto occurred within FEP not at Cu–FEP interface.

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