Three-Dimensional Finite-Element Simulation for a Thermoelectric Generator Module
作者： Xiaokai Hu , Hiroyuki Takazawa , Kazuo Nagase , Michihiro Ohta , Atsushi Yamamoto
DOI: 10.1007/S11664-015-3898-Y
关键词:
摘要: … Simulation results are obtained for the terminal voltage, output power, heat flow, and … heats in all the thermoelectric legs, as functions of the electric current, are calculated by finite-…
harvard.edu
springer.com
sci-hub.se 参考文章(31)
Xianyu Ao, Johannes de Boor, Volker Schmidt, Radiation‐Corrected Harman Method for Characterization of Thermoelectric Materials Advanced Energy Materials. ,vol. 1, pp. 1007- 1011 ,(2011) , 10.1002/AENM.201100272
Min Chen, Lasse Rosendahl, Inger Bach, Thomas Condra, John Pedersen, None, Irreversible transfer processes of thermoelectric generators American Journal of Physics. ,vol. 75, pp. 815- 820 ,(2007) , 10.1119/1.2750373
Emil Sandoz-Rosado, Robert J. Stevens, Experimental Characterization of Thermoelectric Modules and Comparison with Theoretical Models for Power Generation international conference on thermoelectrics. ,vol. 38, pp. 1239- 1244 ,(2009) , 10.1007/S11664-009-0744-0
Dirk Ebling, Martin Jaegle, Markus Bartel, Alexandre Jacquot, Harald Böttner, Multiphysics Simulation of Thermoelectric Systems for Comparison with Experimental Device Performance international conference on thermoelectrics. ,vol. 38, pp. 1456- 1461 ,(2009) , 10.1007/S11664-009-0825-0
Hsin Wang, Wallace D. Porter, Harald Böttner, Jan König, Lidong Chen, Shengqiang Bai, Terry M. Tritt, Alex Mayolet, Jayantha Senawiratne, Charlene Smith, Fred Harris, Patricia Gilbert, Jeff W. Sharp, Jason Lo, Holger Kleinke, Laszlo Kiss, Transport Properties of Bulk Thermoelectrics—An International Round-Robin Study, Part I: Seebeck Coefficient and Electrical Resistivity Journal of Electronic Materials. ,vol. 42, pp. 654- 664 ,(2013) , 10.1007/S11664-012-2396-8
Heng Xiao, Xiaolong Gou, Suwen Yang, Detailed Modeling and Irreversible Transfer Process Analysis of a Multi-Element Thermoelectric Generator System Journal of Electronic Materials. ,vol. 40, pp. 1195- 1201 ,(2011) , 10.1007/S11664-011-1596-Y
Aaron D. LaLonde, Yanzhong Pei, Heng Wang, G. Jeffrey Snyder, Lead telluride alloy thermoelectrics Materials Today. ,vol. 14, pp. 526- 532 ,(2011) , 10.1016/S1369-7021(11)70278-4
D Ebling, K Bartholomé, M Bartel, M Jägle, None, Module Geometry and Contact Resistance of Thermoelectric Generators Analyzed by Multiphysics Simulation Journal of Electronic Materials. ,vol. 39, pp. 1376- 1380 ,(2010) , 10.1007/S11664-010-1331-0
Xun Shi, Jiong Yang, James R. Salvador, Miaofang Chi, Jung Y. Cho, Hsin Wang, Shengqiang Bai, Jihui Yang, Wenqing Zhang, Lidong Chen, Multiple-filled skutterudites: high thermoelectric figure of merit through separately optimizing electrical and thermal transports. Journal of the American Chemical Society. ,vol. 133, pp. 7837- 7846 ,(2011) , 10.1021/JA111199Y
Emil Sandoz-Rosado, Robert Stevens, Robust Finite Element Model for the Design of Thermoelectric Modules Journal of Electronic Materials. ,vol. 39, pp. 1848- 1855 ,(2010) , 10.1007/S11664-010-1077-8