Ultra-thin Al2O3 films grown by atomic layer deposition for corrosion protection of copper

作者: Zhimin Chai , Yuhong Liu , Jing Li , Xinchun Lu , Dannong He

DOI: 10.1039/C4RA09179E

关键词:

摘要: Ultra-thin Al2O3 films with thickness in the range of 4.5–29.4 nm were prepared on a copper substrate by atomic layer deposition (ALD) at temperature 150 °C to protect from corrosion. Auger electron spectroscopy (AES) was employed analyze elemental components film surface and detect distribution depth direction film, force microscopy (AFM) scanning (SEM) measure morphology before after corrosion experiment. Electrochemical impedance (EIS) used anti-corrosion properties 0.1 M NaCl solution. The results demonstrate that high quality ultra-thin uniform in-depth stoichiometry are achieved can efficiently decrease copper. A thicker provide better resistance because its lower porosity. When is 7.8 or above, be well protected, which embodied fact AFM SEM images do not show great difference

参考文章(34)
Belén Díaz, Emma Härkönen, Vincent Maurice, Jolanta Światowska, Antoine Seyeux, Mikko Ritala, Philippe Marcus, Failure mechanism of thin Al2O3 coatings grown by atomic layer deposition for corrosion protection of carbon steel Electrochimica Acta. ,vol. 56, pp. 9609- 9618 ,(2011) , 10.1016/J.ELECTACTA.2011.07.104
Zhimin Chai, Jing Li, Xinchun Lu, Dannong He, Use of electrochemical measurements to investigate the porosity of ultra-thin Al2O3 films prepared by atomic layer deposition RSC Advances. ,vol. 4, pp. 39365- 39371 ,(2014) , 10.1039/C4RA04565C
L. Lapeire, E. Martinez Lombardia, K. Verbeken, I. De Graeve, L.A.I. Kestens, H. Terryn, Effect of neighboring grains on the microscopic corrosion behavior of a grain in polycrystalline copper Corrosion Science. ,vol. 67, pp. 179- 183 ,(2013) , 10.1016/J.CORSCI.2012.10.017
Yadong Zhang, Dragos Seghete, Aziz Abdulagatov, Zachary Gibbs, Andrew Cavanagh, Ronggui Yang, Steven George, Yung-Cheng Lee, Investigation of the defect density in ultra-thin Al2O3 films grown using atomic layer deposition Surface & Coatings Technology. ,vol. 205, pp. 3334- 3339 ,(2011) , 10.1016/J.SURFCOAT.2010.12.001
W. Tato, D. Landolt, Electrochemical Determination of the Porosity of Single and Duplex PVD Coatings of Titanium and Titanium Nitride on Brass Journal of The Electrochemical Society. ,vol. 145, pp. 4173- 4181 ,(1998) , 10.1149/1.1838932
G.P. Cicileo, B.M. Rosales, F.e. Varela, J.R. Vilche, Comparative study of organic inhibitors of coppercorrosion Corrosion Science. ,vol. 41, pp. 1359- 1375 ,(1999) , 10.1016/S0010-938X(98)00190-5
A. I. Abdulagatov, Y. Yan, J. R. Cooper, Y. Zhang, Z. M. Gibbs, A. S. Cavanagh, R. G. Yang, Y. C. Lee, S. M. George, Al2O3 and TiO2 atomic layer deposition on copper for water corrosion resistance. ACS Applied Materials & Interfaces. ,vol. 3, pp. 4593- 4601 ,(2011) , 10.1021/AM2009579
M.D. Groner, J.W. Elam, F.H. Fabreguette, S.M. George, Electrical characterization of thin Al2O3 films grown by atomic layer deposition on silicon and various metal substrates Thin Solid Films. ,vol. 413, pp. 186- 197 ,(2002) , 10.1016/S0040-6090(02)00438-8