作者: Zhimin Chai , Yuhong Liu , Jing Li , Xinchun Lu , Dannong He
DOI: 10.1039/C4RA09179E
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摘要: Ultra-thin Al2O3 films with thickness in the range of 4.5–29.4 nm were prepared on a copper substrate by atomic layer deposition (ALD) at temperature 150 °C to protect from corrosion. Auger electron spectroscopy (AES) was employed analyze elemental components film surface and detect distribution depth direction film, force microscopy (AFM) scanning (SEM) measure morphology before after corrosion experiment. Electrochemical impedance (EIS) used anti-corrosion properties 0.1 M NaCl solution. The results demonstrate that high quality ultra-thin uniform in-depth stoichiometry are achieved can efficiently decrease copper. A thicker provide better resistance because its lower porosity. When is 7.8 or above, be well protected, which embodied fact AFM SEM images do not show great difference