Method and system for MEMS switches fabricated in an integrated circuit package

摘要: Methods and systems for MEMS switches fabricated in an integrated circuit package are disclosed may include controlling switching of RF components, signals handled by the within circuit. One or more switch arrays embedded a multi-layer bonded to be utilized signal control. The components one package. electrically coupled via arrays. electrostatically magnetically activated. capacitor transformers, inductors, transmission lines, microstrip and/or coplanar waveguide filters surface mount devices. multiple-layer utilizing flip-chip bonding technique.